Intel® Xeon® Processors ?
Optimized performance, scale and efficiency across a broad range of data center, edge and workstation workloads. Elevate business productivity with the consistent open Intel® architecture you know and trust.
- The Socket LGA-4677 socket allows processor to be placed on the PCB without soldering
- Xeon W product line processor for better reliability and ensure maximum productivity
- 10 nm enables improved performance per watt and micro architecture makes it power-efficient
- Tetracosa-core (24 Core) processor core efficiently handles data to ensure quicker transfer of information with maximum usability
- 48 MB L2 + 67.50 MB L3 cache memory offers great system performance and avoids interruptions while executing complex and critical tasks
- Processor with 2.70 GHz clock speed for quick and dependable processing of data to ensure maximum productivity
| Brand | |
|---|---|
| Brand | Intel Corporation |
| CPU / Processor | |
|---|---|
| Processor Manufacturer | Intel |
| Intel vPro Technology | Yes |
| 64-bit Processing | Yes |
| Processor Threads | 48 |
| Processor Core | Tetracosa-core (24 Core) |
| Clock Speed | 2.70 GHz |
| Overclocking Speed | 4.80 GHz |
| Processor Socket | Socket LGA-4677 |
| L3 Cache | 67.50 MB |
| L2 Cache | 48 MB |
| Process Technology | 10 nm |
| Direct Media Interface | 16 GT/s |
| Thermal Design Power | 310 W |
| Memory / RAM | |
|---|---|
| Memory Standard Supported | DDR5-4800/PC5-38400 |
| Memory Technology Supported | DDR5 SDRAM |
| Memory Speed Supported | 4.80 GHz |
| Security | |
|---|---|
| Intel Trusted Execution Techn | Yes |
| General Features | |
|---|---|
| Manufacturer | Intel Corporation |
| Thermal Specification | 168.8°F (76°C) |
| Packaging & Origin | |
|---|---|
| Package Type | OEM |
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