Intel® Xeon® Processors ?
Optimized performance, scale and efficiency across a broad range of data center, edge and workstation workloads. Elevate business productivity with the consistent open Intel® architecture you know and trust.
- The Socket LGA-4677 socket allows processor to be placed on the PCB without soldering
- Xeon W product line processor for your convenience and optimal usage
- 10 nm design offers great efficiency for computing, delivers nimble processing with balanced cost, performance, and power
- Icosa-core (20 Core) processor core helps processor process data in a dependable and timely manner with maximum productivity
- 52.50 MB of L3 cache memory provides excellent hit rate in short access time enabling improved system performance
- Processor with 2.90 GHz clock speed for faster, efficient execution of cycles per second to ensure maximum usability
| Brand | |
|---|---|
| Brand | Intel Corporation |
| CPU / Processor | |
|---|---|
| Processor Manufacturer | Intel |
| Intel vPro Technology | Yes |
| 64-bit Processing | Yes |
| Processor Threads | 40 |
| Processor Core | Icosa-core (20 Core) |
| Clock Speed | 2.90 GHz |
| Overclocking Speed | 4.80 GHz |
| Processor Socket | Socket LGA-4677 |
| L3 Cache | 52.50 MB |
| L2 Cache | 40 MB |
| Process Technology | 10 nm |
| Direct Media Interface | 16 GT/s |
| Thermal Design Power | 300 W |
| Memory / RAM | |
|---|---|
| Memory Standard Supported | DDR5-4800/PC5-38400 |
| Memory Technology Supported | DDR5 SDRAM |
| Memory Speed Supported | 4.80 GHz |
| Security | |
|---|---|
| Intel Trusted Execution Techn | Yes |
| General Features | |
|---|---|
| Manufacturer | Intel Corporation |
| Thermal Specification | 168.8°F (76°C) |
| Packaging & Origin | |
|---|---|
| Package Type | OEM |
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