Skip to Content

HPE Intel Xeon Gold 5218 Hexadeca-core (16 Core) 2.30 GHz Processor Upgrade

2,374.99 2,374.99
2,374.99

2,374.99 / Units
  • Brand
  • Processor Manufacturer
  • Depth
  • Product Name
  • Marketing Information
  • Brand Name
  • Manufacturer Part Number
  • Width
  • 64-bit Processing
  • Processor Core
  • Clock Speed
  • Overclocking Speed
  • Processor Socket
  • L3 Cache
  • Process Technology
  • Thermal Design Power
  • Manufacturer
  • Product Type
  • Product Line
  • Product Model
  • Compatibility
  • Manufacturer Website Address
  • Thermal Specification
This product is eligible for 30-day returns subject to a restocking fee. See our return policy for details. Terms and Conditions
Shipping: 1-6 Business Days

INTEL® XEON® GOLD PROCESSORS

With support for the higher memory speeds, enhanced memory capacity, and four-socket scalability, Intel® Xeon® Gold processors deliver significant improvement in performance, advanced reliability, and hardware-enhanced security. It is optimized for demanding mainstream data center, multi-cloud compute, and network and storage workloads. With up-to four-socket scalability, it is suitable for an expanded range of workloads.

  • The processor upgrade features Socket 3647 socket for installation on the PCB
  • Xeon Gold product line processor upgrade for better usability and increased efficiency
  • 14 nm enables improved performance per watt and micro architecture makes it power-efficient
  • Hexadeca-core (16 Core) processor core efficiently handles data to ensure quicker transfer of information with maximum usability
  • 22 MB of L3 cache to boost the instruction processing and system performance
  • Processor Upgrade with 2.30 GHz clock speed for faster, efficient execution of cycles per second to ensure maximum usability
Brand
Brand Hewlett Packard Enterprise
CPU / Processor
Processor Manufacturer Intel
64-bit Processing Yes
Processor Core Hexadeca-core (16 Core)
Clock Speed 2.30 GHz
Overclocking Speed 3.90 GHz
Processor Socket Socket 3647
L3 Cache 22 MB
Process Technology 14 nm
Thermal Design Power 125 W
General Features
Manufacturer Hewlett Packard Enterprise
Thermal Specification 188.6°F (87°C)