Performance Made Flexible
We know that you must build for your needs of today while planning for unknown future demands. Flexible infrastructure is key, one that is optimized for multi-cloud and AI, serving many workloads, anywhere, at any time.
That's why we've created a platform that delivers the flexibility you need, bringing AI everywhere, from edge to cloud, helping our customers achieve more. More performance. More efficiency. And more wonderful.
3rd Gen Intel® Xeon® Scalable processors offer a balanced architecture with built-in acceleration and advanced security capabilities, designed through decades of innovation for the most in-demand workload requirements.
Through partnership with the world's software leaders and solution providers, 3rd Gen Intel Xeon Scalable processors are optimized for specific customer workload types and performance levels, all with the consistent, open Intel architecture you know and trust.
- The Socket LGA-4189 socket allows processor to be placed on the PCB without soldering
- Xeon Platinum product line processor for better usability and increased efficiency
- 10 nm enables improved performance per watt and micro architecture makes it power-efficient
- Dotriaconta-core (32 Core) processor core allows multitasking with great reliability and fast processing speed
- 3rd Gen processor generation provides an improved power efficiency with maximum dependability and longevity
- 48 MB of L3 cache memory offers great system performance and avoids interruptions while executing complex and critical tasks
- Processor with 2.30 GHz clock speed for faster, efficient execution of cycles per second to ensure maximum usability
| Brand | |
|---|---|
| Brand | Intel Corporation |
| CPU / Processor | |
|---|---|
| Processor Manufacturer | Intel |
| 64-bit Processing | Yes |
| Processor Generation | 3rd Gen |
| Processor Threads | 64 |
| Processor Core | Dotriaconta-core (32 Core) |
| Clock Speed | 2.30 GHz |
| Overclocking Speed | 3.50 GHz |
| Processor Socket | Socket LGA-4189 |
| L3 Cache | 48 MB |
| Process Technology | 10 nm |
| Thermal Design Power | 185 W |
| General Features | |
|---|---|
| Manufacturer | Intel Corporation |
| Thermal Specification | 170.6°F (77°C) |
| Packaging & Origin | |
|---|---|
| Package Type | OEM |